COB Assembly
Besides CIS,Syscan also provide COB (chip–on-board) service for CCM (Compact Camera Module) that used for Cell phone, computer and so on, and Mainly 0.3M pixel, the size from 6.0mm to 9.0mm.
Production Capacity: 600K monthly.
Production Capacity: 600K monthly.
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Syscan Industry Park is ISO9001: 2000 approved and is equipped with advanced manufacture equipments including optical chip | |
| testing machines, wafer cutting machines, wafer clearing machines, auto die Bonding machines, auto wirebonding |  |
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| machines,ACF Bonding machine, auto firing machine, auto coating machines, and computer spectrum testing analyzers. The annual CIS production capacity is about 2,500,000 units. | ||
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